The Vision MARK-1 for Solder Paste Quality Control provides rapid, small sample solder paste measurements for quality control solutions.
Prior to Printing Quality Control
Reduce printing and reflow defects by monitoring solder paste quality before printing.
In Process Paste Condition Monitoring
Increase line utilization by extending stencil life of solder paste. Avoid unnecessary setups and wasted solder paste caused by premature disposal.
Printing Defect Troubleshooting and Root Cause Analysis
Quickly eliminate solder paste as the root cause of defects in your manufacturing process.
Quick Detection of Paste Quality
Verify correct solder paste handling throughout shipping, storage, and use.
Catch defective paste that may cause short stencil life, poor tack, solder balling, nonwetting, and de-wetting.
Extend Solder Paste Stencil Life
Directly determine end of solder paste stencil life to increase line utilization
Requires only 5 grams of solder paste
Receive measurement results in under 4 minutes
Clear Control Indicators
Customizable process control limits with red, yellow, and green light indicators
Correlates to Standards
Measurements correlate to J-STD-005 standards and TM-650 test methods