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Hand-held measurements for Solder Paste Quality Control
The Vision MARK-1 for Solder Paste Quality Control provides rapid, small sample solder paste measurements for quality control solutions.
Applications
Prior to Printing Quality Control
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Reduce printing and reflow defects by monitoring solder paste quality before printing.
In Process Paste Condition Monitoring
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Increase line utilization by extending stencil life of solder paste. Avoid unnecessary setups and wasted solder paste caused by premature disposal.
Printing Defect Troubleshooting and Root Cause Analysis
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Quickly eliminate solder paste as the root cause of defects in your manufacturing process.
Benefits
Quick Detection of Paste Quality
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Verify correct solder paste handling throughout shipping, storage, and use.
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Catch defective paste that may cause short stencil life, poor tack, solder balling, nonwetting, and de-wetting.
Extend Solder Paste Stencil Life
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Directly determine end of solder paste stencil life to increase line utilization
Small-Sample Requirements
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Requires only 5 grams of solder paste
Rapid Measurement
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Receive measurement results in under 4 minutes
Clear Control Indicators
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Customizable process control limits with red, yellow, and green light indicators
Correlates to Standards
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Measurements correlate to J-STD-005 standards and TM-650 test methods